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1 : $64.2565

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Rochester Electronics SN74ACT7205L35NP

FIFO, 8KX9, 35NS, ASYNCHRONOUS
part number has RoHS
Manufacturer # :SN74ACT7205L35NP
Manufacturer :Rochester Electronics
Dasenic # :SN74ACT7205L35NP-DS
Customer # :
Description : FIFO, 8KX9, 35NS, ASYNCHRONOUS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 64.2565$ 64.26
25+$ 62.9995$ 1574.99
100+$ 60.4114$ 6041.14
500+$ 57.8234$ 28911.7
1000+$ 54.6439$ 54643.9
In Stock: 6300
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 64.2565
Total :$ 64.26
Delivery :
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Payment :
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SN74ACT7205L35NP information

  • Rochester Electronics SN74ACT7205L35NP technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Memory Size:-
  • Voltage - Supply:-
  • Current - Supply ( Max):-
  • Data Rate:-
  • Access Time:-
  • Bus Directional:-
  • Expansion Type:-
  • Programmable Flags Support:-
  • Retransmit Capability:-
  • F W F T Support:-
  • Function:-
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8542.32.0071
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74ACT7205L35NP provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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