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1 : $13.4550
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Rochester Electronics SN74ABTH32316PN
IC UNIV BUS EXCHANGER 80LQFP
Manufacturer # :SN74ABTH32316PN
Manufacturer :Rochester Electronics
Dasenic # :SN74ABTH32316PN-DS
Datasheet :
SN74ABTH32316PN Datasheet
SN74ABTH32316PN DatasheetCustomer # :
Description : IC UNIV BUS EXCHANGER 80LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 13.4550 | $ 13.46 |
| 25+ | $ 13.1850 | $ 329.63 |
| 100+ | $ 12.6450 | $ 1264.5 |
| 500+ | $ 12.1140 | $ 6057 |
| 1000+ | $ 11.4390 | $ 11439 |
In Stock: 6024
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 13.455
Total :$ 13.46
Delivery :
Payment :
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SN74ABTH32316PN information
Rochester Electronics SN74ABTH32316PN technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Universal Bus Functions
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:80-LQFP
- Supplier Device Package:80-LQFP (12x12)
- Number of Circuits:16-Bit, Tri-Port
- Voltage - Supply:4.5V ~ 5.5V
- Logic Type:Universal Bus Exchanger
- Current - Output High, Low:32mA, 64mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74ABTH32316PN provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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