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Rochester Electronics SN74ABT7820-20PN

IC 512X18X2 BI-DIR MEM 80-LQFP
part number has RoHS
Manufacturer # :SN74ABT7820-20PN
Manufacturer :Rochester Electronics
Dasenic # :SN74ABT7820-20PN-DS
Customer # :
Description : IC 512X18X2 BI-DIR MEM 80-LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
16+$ 17.4690$ 279.5
In Stock: 8220
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.469
Total :$ 17.47
Delivery :
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SN74ABT7820-20PN information

  • Rochester Electronics SN74ABT7820-20PN technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:80-LQFP
  • Supplier Device Package:80-LQFP (12x12)
  • Memory Size:18K (512 x 18 x 2)
  • Voltage - Supply:4.5 V ~ 5.5 V
  • Current - Supply ( Max):95mA
  • Data Rate:50MHz
  • Access Time:13.5ns
  • Bus Directional:Bi-Directional
  • Expansion Type:-
  • Programmable Flags Support:Yes
  • Retransmit Capability:No
  • F W F T Support:No
  • Function:Asynchronous
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.32.0071
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SN74ABT7820-20PN provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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