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Rochester Electronics SM320VC5507PGESEP

IC DSP 16BIT DGTL 144-LQFP
part number has RoHS
Manufacturer # :SM320VC5507PGESEP
Manufacturer :Rochester Electronics
Dasenic # :SM320VC5507PGESEP-DS
Customer # :
Description : IC DSP 16BIT DGTL 144-LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 25.0020$ 25
25+$ 24.4980$ 612.45
100+$ 23.4990$ 2349.9
500+$ 22.5000$ 11250
1000+$ 21.2490$ 21249
In Stock: 1799
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 25.002
Total :$ 25.00
Delivery :
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Payment :
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SM320VC5507PGESEP information

  • Rochester Electronics SM320VC5507PGESEP technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:-55°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:144-LQFP
  • Type:Fixed Point
  • Interface:EBI/EMI, HPI, I²C, McBSP, USB
  • Supplier Device Package:144-LQFP (20x20)
  • Clock Rate:200MHz
  • Non- Volatile Memory:ROM (64kB)
  • On- Chip R A M:128KB
  • Voltage - I/ O:3.30V
  • Voltage - Core:1.2V, 1.35V, 1.6V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:4 (72 Hours)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SM320VC5507PGESEP provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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