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Rochester Electronics SIT2018BEES3-18N-27.000000E
MEMS OSC XO 27.0000MHZ LVCMOS LV
Manufacturer # :SIT2018BEES3-18N-27.000000E
Manufacturer :Rochester Electronics
Dasenic # :SIT2018BEES3-18N-27.000000E-DS
Datasheet :
SIT2018BEES3-18N-27.000000E Datasheet
SIT2018BEES3-18N-27.000000E DatasheetCustomer # :
Description : MEMS OSC XO 27.0000MHZ LVCMOS LV -
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.5912 | $ 0.59 |
| 25+ | $ 0.5794 | $ 14.49 |
| 100+ | $ 0.5558 | $ 55.58 |
| 500+ | $ 0.5321 | $ 266.05 |
| 1000+ | $ 0.5026 | $ 502.6 |
In Stock: 40993
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5912
Total :$ 0.59
Delivery :
Payment :
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SIT2018BEES3-18N-27.000000E information
Rochester Electronics SIT2018BEES3-18N-27.000000E technical specifications, attributes, parameters.
- Category:Oscillators & Resonators/Oscillators
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C
- Ratings:-
- Mounting Type:-
- Package / Case:-
- Size / Dimension:0.114" L x 0.063" W (2.90mm x 1.60mm)
- Height - Seated ( Max):0.057" (1.45mm)
- Frequency:27 MHz
- Type:XO (Standard)
- Frequency Stability:±50ppm
- Base Resonator:MEMS
- Output:LVCMOS, LVTTL
- Voltage - Supply:1.8V
- Absolute Pull Range ( A P R):-
- Spread Spectrum Bandwidth:-
- Current - Supply ( Max):-
- Function:-
SIT2018BEES3-18N-27.000000E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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