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Rochester Electronics SCH2102-TL-E
BIP PNP+PNP 0.5A 12V
Manufacturer # :SCH2102-TL-E
Manufacturer :Rochester Electronics
Dasenic # :SCH2102-TL-E-DS
Datasheet :
SCH2102-TL-E Datasheet
SCH2102-TL-E DatasheetCustomer # :
Description : BIP PNP+PNP 0.5A 12V
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0180 | $ 0.02 |
In Stock: 41500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.018
Total :$ 0.02
Delivery :
Payment :
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SCH2102-TL-E information
Rochester Electronics SCH2102-TL-E technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
- Product Status:Obsolete
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:6-SMD, Flat Leads
- Power - Max:400mW
- Supplier Device Package:6-SCH
- Transistor Type:2 PNP (Dual)
- Current - Collector ( Ic) ( Max):500mA
- Voltage - Collector Emitter Breakdown ( Max):12V
- Vce Saturation ( Max) @ Ib, Ic:300mV @ 10mA, 200mA
- Current - Collector Cutoff ( Max):100nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:300 @ 10mA, 2V
- Frequency - Transition:490MHz
- EU RoHS Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:0000.00.0000
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SCH2102-TL-E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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