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Rochester Electronics SC1201UFH-266B
SC1201 - 32-BIT MICROPROCESSOR
Manufacturer # :SC1201UFH-266B
Manufacturer :Rochester Electronics
Dasenic # :SC1201UFH-266B-DS
Datasheet :
SC1201UFH-266B Datasheet
SC1201UFH-266B DatasheetCustomer # :
Description : SC1201 - 32-BIT MICROPROCESSOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 53.4510 | $ 53.45 |
| 25+ | $ 52.3800 | $ 1309.5 |
| 100+ | $ 50.2470 | $ 5024.7 |
| 500+ | $ 48.1050 | $ 24052.5 |
| 1000+ | $ 45.4320 | $ 45432 |
In Stock: 1537
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 53.451
Total :$ 53.45
Delivery :
Payment :
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SC1201UFH-266B information
Rochester Electronics SC1201UFH-266B technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - System On Chip (SoC)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TC)
- Package / Case:481-BFBGA
- Supplier Device Package:481-BGA (40x40)
- Peripherals:AC97/AMC97, DMA, PCI, SmartCard, WDT
- Architecture:MPU
- Speed:266MHz
- Core Processor:x86
- Flash Size:-
- R A M Size:-
- Connectivity:Access.bus, GPIO, PC/AT, UART
- Primary Attributes:-
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Affected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SC1201UFH-266B provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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