Name: SB2176CR
Brand: Rochester Electronics
SKU: DS-5720258
Price: 0.009 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Rochester Electronics SB2176CR

IC CABLE MODEM TXCVR 208-SQFP

Manufacturer # :SB2176CR

Manufacturer :Rochester Electronics

Dasenic # :SB2176CR-DS

Datasheet :

SB2176CR Datasheet

Customer # :

Customer #

Description : IC CABLE MODEM TXCVR 208-SQFP

Pricing (USD) : *To apply for a price, please click the Send Target Price button

Quantity	Unit Price	Total
1+	$ 0.0090	$ 0.01
10+	$ 0.0090	$ 0.09
100+	$ 0.0090	$ 0.9
500+	$ 0.0090	$ 4.5
1000+	$ 0.0090	$ 9

In Stock: 52246

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 0.009

Total :$ 0.01

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SB2176CR information

Rochester Electronics SB2176CR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Interface - Modems - ICs and Modules
Product Status:Obsolete
Mounting Type:-
Package / Case:208-QFP
Supplier Device Package:208-SQFP (28x28)
Voltage - Supply:-
Data Format:-
Baud Rates:-
EU RoHS Status:RoHS non-compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
US ECCN:5A991B2
HTS US:8542.39.0001
REACH Status:Vendor is not defined
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Rochester Electronics SB2176CR
Datasheet:
SB2176CR,

Rochester Electronics SB2176CR Environmental and export classification status description
The Intel Corporation SB2176CR is a highly versatile integrated circuit manufactured by Intel Corporation. It features advanced capabilities suited for various applications in the electronics industry. Functions: The SB2176CR offers a range of functions including processing, memory management, input/output control, and system integration features to meet the demands of complex electronic systems. Applications: This integrated circuit is commonly utilized in embedded systems, consumer electronics, industrial automation, telecommunications, automotive, and other fields that require reliable and high-performance ICs. Alternative Components: Alternative components to the SB2176CR include ICs from other manufacturers such as Texas Instruments, Microchip Technology, and STMicroelectronics, which offer similar functionalities and features. Embedded Modules: Embedded modules compatible with the SB2176CR may include communication interfaces, sensor integration modules, power management units, and other specialized modules to enhance the overall functionality of the IC in specific applications. --- Related Q&A: 1. What are the key features that set Intel Corporation SB2176CR apart from its competitors in the IC market? 2. Can the SB2176CR be used in IoT devices for data processing and connectivity? 3. How does the SB2176CR contribute to energy efficiency in industrial automation applications? 4. Are there specific programming languages or development tools recommended for designing applications using the SB2176CR IC? 5. What are the typical operating temperatures and environmental conditions within which the SB2176CR operates effectively?

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

SB2176CR provided by Rochester Electronics

As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.