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1 : $7.6950
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Rochester Electronics SAA7709H/N103S,557
IC DSP CAR RADIO 80QFP
Manufacturer # :SAA7709H/N103S,557
Manufacturer :Rochester Electronics
Dasenic # :SAA7709H/N103S,557-DS
Datasheet :
SAA7709H/N103S,557 Datasheet
SAA7709H/N103S,557 DatasheetCustomer # :
Description : IC DSP CAR RADIO 80QFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 7.6950 | $ 7.7 |
| 25+ | $ 7.5420 | $ 188.55 |
| 100+ | $ 7.2360 | $ 723.6 |
| 500+ | $ 6.9300 | $ 3465 |
| 1000+ | $ 6.5430 | $ 6543 |
In Stock: 59004
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.695
Total :$ 7.70
Delivery :
Payment :
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SAA7709H/N103S,557 information
Rochester Electronics SAA7709H/N103S,557 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:80-BQFP
- Type:Car Signal Processor
- Interface:I²C, I²S, LSB, SPDIF
- Supplier Device Package:80-PQFP (14x20)
- Clock Rate:-
- Non- Volatile Memory:-
- On- Chip R A M:-
- Voltage - I/ O:3.30V
- Voltage - Core:3.30V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SAA7709H/N103S,557 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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