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Rochester Electronics RURG3060CC
DIODE ARRAY GP 600V 30A TO247
Manufacturer # :RURG3060CC
Manufacturer :Rochester Electronics
Dasenic # :RURG3060CC-DS
Datasheet :
RURG3060CC Datasheet
RURG3060CC DatasheetCustomer # :
Description : DIODE ARRAY GP 600V 30A TO247
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 60+ | $ 2.9070 | $ 174.42 |
| 180+ | $ 2.6910 | $ 484.38 |
In Stock: 1680
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.907
Total :$ 2.91
Delivery :
Payment :
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RURG3060CC information
Rochester Electronics RURG3060CC technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
- Product Status:Active
- Mounting Type:Through Hole
- Package / Case:TO-247-3
- Supplier Device Package:TO-247-3
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Diode Type:Standard
- Voltage - Forward ( Vf) ( Max) @ If:1.5 V @ 30 A
- Current - Reverse Leakage @ Vr:250 µA @ 600 V
- Diode Configuration:1 Pair Common Cathode
- Voltage - D C Reverse ( Vr) ( Max):600 V
- Current - Average Rectified ( Io) (per Diode):30A
- Reverse Recovery Time (trr):60 ns
- Operating Temperature - Junction:-65°C ~ 175°C
- US ECCN:EAR99
- HTS US:8541.10.0080
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
RURG3060CC provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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