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Rochester Electronics RURD620CCS9A-SB82068
Manufacturer # :RURD620CCS9A-SB82068
Manufacturer :Rochester Electronics
Dasenic # :RURD620CCS9A-SB82068-DS
Datasheet : RURD620CCS9A-SB82068 Datasheet
Customer # :
Description : RECTIFIER DIODE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 15000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7508
Total :$ 0.75
Delivery :
Payment :
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RURD620CCS9A-SB82068 information
Rochester Electronics RURD620CCS9A-SB82068 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
- Product Status:Obsolete
- Mounting Type:Surface Mount
- Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63
- Supplier Device Package:TO-252, (D-Pak)
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Diode Type:Standard
- Voltage - Forward ( Vf) ( Max) @ If:1 V @ 6 A
- Current - Reverse Leakage @ Vr:100 µA @ 200 V
- Diode Configuration:1 Pair Common Cathode
- Voltage - D C Reverse ( Vr) ( Max):200 V
- Current - Average Rectified ( Io) (per Diode):6A
- Reverse Recovery Time (trr):30 ns
- Operating Temperature - Junction:-65°C ~ 175°C
- EU RoHS Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8541.10.0080
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
RURD620CCS9A-SB82068 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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