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Rochester Electronics RKD703KK#R6

SCHOTTKY BARRIER DIODE
part number has RoHS
Manufacturer # :RKD703KK#R6
Manufacturer :Rochester Electronics
Dasenic # :RKD703KK#R6-DS
Customer # :
Description : SCHOTTKY BARRIER DIODE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.1485$ 1.49
2704+$ 0.0990$ 267.7
In Stock: 69
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1485
Total :$ 0.15
Delivery :
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Payment :
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RKD703KK#R6 information

  • Rochester Electronics RKD703KK#R6 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Single
  • Product Status:Obsolete
  • Mounting Type:Surface Mount
  • Package / Case:2-SMD, Flat Lead
  • Supplier Device Package:2-SFP
  • Speed:Small Signal =< 200mA (Io), Any Speed
  • Diode Type:Schottky
  • Current - Average Rectified ( Io):100mA
  • Voltage - Forward ( Vf) ( Max) @ If:600 mV @ 100 mA
  • Current - Reverse Leakage @ Vr:50 µA @ 30 V
  • Capacitance @ Vr, F:5pF @ 1V, 1MHz
  • Voltage - D C Reverse ( Vr) ( Max):30 V
  • Reverse Recovery Time (trr):-
  • Operating Temperature - Junction:125°C (Max)
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
RKD703KK#R6 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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