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Rochester Electronics RJK0329DPB-01#J0
MOSFET N-CH 30V 55A LFPAK
Manufacturer # :RJK0329DPB-01#J0
Manufacturer :Rochester Electronics
Dasenic # :RJK0329DPB-01#J0-DS
Datasheet :
RJK0329DPB-01#J0 Datasheet
RJK0329DPB-01#J0 DatasheetCustomer # :
Description : MOSFET N-CH 30V 55A LFPAK
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| Quantity | Unit Price | Total |
In Stock: 55
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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RJK0329DPB-01#J0 information
Rochester Electronics RJK0329DPB-01#J0 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
- Product Status:Obsolete
- Operating Temperature:150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:SC-100, SOT-669
- Technology:MOSFET (Metal Oxide)
- Supplier Device Package:LFPAK
- Power Dissipation ( Max):60W (Tc)
- F E T Type:N-Channel
- F E T Feature:-
- Drain to Source Voltage ( Vdss):30 V
- Current - Continuous Drain ( Id) @ 25° C:55A (Ta)
- Rds On ( Max) @ Id, Vgs:2.3mOhm @ 27.5A, 10V
- Vgs(th) ( Max) @ Id:2.5V @ 1mA
- Gate Charge ( Qg) ( Max) @ Vgs:35 nC @ 4.5 V
- Input Capacitance ( Ciss) ( Max) @ Vds:5330 pF @ 10 V
- Drive Voltage ( Max Rds On, Min Rds On):-
- Vgs ( Max):-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
RJK0329DPB-01#J0 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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