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Rochester Electronics REF02EZ

IC VREF SERIES 0.3% 8CERDIP
part number has RoHS
Manufacturer # :REF02EZ
Manufacturer :Rochester Electronics
Dasenic # :REF02EZ-DS
Customer # :
Description : IC VREF SERIES 0.3% 8CERDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 17.8830$ 17.88
1000+$ 11.3850$ 11385
In Stock: 1644
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.883
Total :$ 17.88
Delivery :
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Payment :
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REF02EZ information

  • Rochester Electronics REF02EZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Voltage Reference
  • Product Status:Active
  • Tolerance:±0.3%
  • Temperature Coefficient:8.5ppm/°C
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:8-CDIP (0.300", 7.62mm)
  • Current - Supply:1.4mA
  • Voltage - Input:7V ~ 40V
  • Output Type:Fixed
  • Supplier Device Package:8-CERDIP
  • Reference Type:Series
  • Current - Output:10 mA
  • Voltage - Output ( Min/ Fixed):5V
  • Voltage - Output ( Max):-
  • Noise - 0.1 Hz to 10 Hz:15µVp-p
  • Noise - 10 Hz to 10k Hz:-
  • Current - Cathode:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
REF02EZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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