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Rochester Electronics RC1117M25
Manufacturer # :RC1117M25
Manufacturer :Rochester Electronics
Dasenic # :RC1117M25-DS
Datasheet : RC1117M25 Datasheet
Customer # :
Description : IC REG LINEAR FIXED LDO REG
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 12444
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.215
Total :$ 0.21
Delivery :
Payment :
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RC1117M25 information
Rochester Electronics RC1117M25 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - Linear
- Product Status:Active
- Operating Temperature:0°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
- Output Type:Fixed
- Voltage - Input ( Max):7.5V
- Supplier Device Package:D2PAK (TO-263)
- Current - Supply ( Max):-
- Current - Output:1A
- Current - Quiescent ( Iq):13 mA
- Control Features:-
- Output Configuration:Positive
- Voltage - Output ( Min/ Fixed):2.5V
- Voltage - Output ( Max):-
- Number of Regulators:1
- Voltage Dropout ( Max):1.2V @ 1A
- P S R R:72dB (120Hz)
- Protection Features:Over Current, Over Temperature, Short Circuit
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
RC1117M25 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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