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Rochester Electronics R5F21364CDFA#V0
Manufacturer # :R5F21364CDFA#V0
Manufacturer :Rochester Electronics
Dasenic # :R5F21364CDFA#V0-DS
Datasheet : R5F21364CDFA#V0 Datasheet
Customer # :
Description : IC MCU 16BIT 16KB FLASH 64LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 18761
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 13.32
Total :$ 13.32
Delivery :
Payment :
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R5F21364CDFA#V0 information
Rochester Electronics R5F21364CDFA#V0 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:64-LQFP
- Supplier Device Package:64-LQFP (14x14)
- Peripherals:POR, PWM, Voltage Detect, WDT
- Number of I/ O:59
- Speed:20MHz
- E E P R O M Size:-
- Core Processor:R8C
- R A M Size:1.5K x 8
- Program Memory Type:Flash
- Core Size:16-Bit
- Connectivity:I²C, LINbus, SIO, SSU, UART/USART
- Program Memory Size:16KB (16K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.8V ~ 5.5V
- Data Converters:A/D 12x10b; D/A 2x8b
- Oscillator Type:Internal
- EU RoHS Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.31.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
R5F21364CDFA#V0 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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