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1 : $4.3290

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Rochester Electronics QS7202-20P

QUALITY SEMI FIFO 1KX9 ASYNC
part number has RoHS
Manufacturer # :QS7202-20P
Manufacturer :Rochester Electronics
Dasenic # :QS7202-20P-DS
Customer # :
Description : QUALITY SEMI FIFO 1KX9 ASYNC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.3290$ 4.33
25+$ 4.2390$ 105.98
100+$ 4.0680$ 406.8
500+$ 3.8970$ 1948.5
1000+$ 3.6810$ 3681
In Stock: 3522
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.329
Total :$ 4.33
Delivery :
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Payment :
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QS7202-20P information

  • Rochester Electronics QS7202-20P technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:-
  • Supplier Device Package:-
  • Memory Size:9K (1K x 9)
  • Voltage - Supply:-
  • Current - Supply ( Max):100mA
  • Data Rate:33MHz
  • Access Time:20ns
  • Bus Directional:-
  • Expansion Type:Depth, Width
  • Programmable Flags Support:No
  • Retransmit Capability:Yes
  • F W F T Support:No
  • Function:Asynchronous
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.32.0071
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
QS7202-20P provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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