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1 : $19.1340

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Rochester Electronics PXB4000EV1.3-G

NETWORK PROCESSOR SYSTEM-ON-CHIP
part number has RoHS
Manufacturer # :PXB4000EV1.3-G
Manufacturer :Rochester Electronics
Dasenic # :PXB4000EV1.3-G-DS
Customer # :
Description : NETWORK PROCESSOR SYSTEM-ON-CHIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 19.1340$ 19.13
25+$ 18.7470$ 468.68
100+$ 17.9820$ 1798.2
500+$ 17.2170$ 8608.5
1000+$ 16.2630$ 16263
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 19.134
Total :$ 19.13
Delivery :
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Payment :
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PXB4000EV1.3-G information

  • Rochester Electronics PXB4000EV1.3-G technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microprocessors
  • Product Status:Active
  • Operating Temperature:-
  • Package / Case:-
  • Supplier Device Package:-
  • Voltage - I/ O:-
  • Speed:-
  • Core Processor:-
  • Number of Cores/ Bus Width:-
  • Co- Processors/ D S P:-
  • R A M Controllers:-
  • Graphics Acceleration:-
  • Display & Interface Controllers:-
  • Ethernet:-
  • S A T A:-
  • U S B:-
  • Security Features:-
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH is not affected
  • HTS US:0000.00.0000
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
PXB4000EV1.3-G provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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