Name: PSB21150FV1.4
Brand: Rochester Electronics
SKU: DS-5736805
Price: 0.9 USD
Availability: InStock
Rating: 4.8 (3 reviews)

Images are for reference only.

1 : $0.9000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Rochester Electronics PSB21150FV1.4

PSB21150 - IPAC-X ISDN PC ADAPTE

Manufacturer # :PSB21150FV1.4

Manufacturer :Rochester Electronics

Dasenic # :PSB21150FV1.4-DS

Datasheet :

PSB21150FV1.4 Datasheet

Customer # :

Customer #

Description : PSB21150 - IPAC-X ISDN PC ADAPTE

Pricing (USD) : *To apply for a price, please click the Send Target Price button

Quantity	Unit Price	Total
1+	$ 0.9000	$ 0.9
100+	$ 0.8370	$ 83.7
1000+	$ 0.8100	$ 810
10000+	$ 0.7650	$ 7650

In Stock: 53139

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 0.9

Total :$ 0.90

Delivery :

Payment :

Help you to save your cost and time

Strict quality inspection and Reliable package for goods

Fast Reliable delivery to save time

Provide 365 days warranty after-sales service

PSB21150FV1.4 information

Rochester Electronics PSB21150FV1.4 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Interface - Telecom
Product Status:Active
Operating Temperature:0°C ~ 70°C
Mounting Type:Surface Mount
Package / Case:64-LQFP
Current - Supply:30mA
Interface:HDLC, IOM-2, ISDN, SCI
Supplier Device Package:PG-TQFP-64-1
Number of Circuits:1
Power ( Watts):-
Voltage - Supply:3.135V ~ 3.465V
Function:PC Adapter Circuit
HTS US:0000.00.0000
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Rochester Electronics PSB21150FV1.4
Datasheet:
PSB21150FV1.4,

Rochester Electronics PSB21150FV1.4 Environmental and export classification status description
The Infineon Technologies PSB21150FV1.4 is an Integrated Circuit (IC) targeted for specific applications within the field of communication and networking. It is designed to offer efficient processing capabilities while minimizing power consumption. The IC showcases Infineon's expertise in providing optimized solutions for telecommunications and networking equipment. Functions: The PSB21150FV1.4 IC performs various functions critical for communication and networking applications, including but not limited to signal processing, data handling, protocol implementation, and interfacing capabilities. These functions are tailored to enhance the performance and reliability of the equipment in which the IC is integrated. Applications: The PSB21150FV1.4 IC can be found in a range of communication and networking devices such as routers, switches, access points, modems, and other equipment requiring efficient processing of data streams. Its applications span across wired and wireless networking infrastructures where high-speed data processing and reliable communication are paramount. Alternative Components: While the PSB21150FV1.4 IC offers specific functionalities and performance characteristics, alternative components from manufacturers such as Broadcom, Qualcomm, Texas Instruments, and MediaTek may also be considered based on the required specifications and compatibility with the targeted application. Embedded Modules: The PSB21150FV1.4 IC may be found integrated into embedded modules or systems-on-chip (SoCs) that provide a comprehensive solution for communication and networking applications. These embedded modules often combine the IC with additional components such as memory, interfaces, and specialized processing units to offer a complete solution to developers. Related Q&A: 1. What are the key features that set the Infineon Technologies PSB21150FV1.4 apart from other ICs in the communication and networking domain? 2. How does the PSB21150FV1.4 IC optimize power consumption while maintaining high processing performance in networking equipment? 3. Can the PSB21150FV1.4 IC be used in industrial networking applications that require robust and reliable communication protocols? 4. Are there any specific design considerations or best practices when integrating the PSB21150FV1.4 IC into a communication device for optimal performance? 5. What are the typical data rates supported by the PSB21150FV1.4 IC, and how does it contribute to enhancing the overall network throughput in modern communication systems?

1.Sign in or as a visitor

You can place an order after registration or purchase products directly as a visitor.

2.Search product

Search to find the part number of the product you need to order.

3.Add to cart

After finding the product. Then add the products to your shopping cart directly.

4.Filling Address and Secure Checkout

Please fill the shipping address and express information when placing your order.

5.Pay the orders

You can pay the orders on the website directly or pay by wire transfer offline. We support: Paypal ,VISA , WIRE TRANSFER.

6.Tracking Your Order

We will dispatch your order within 24 hours and provide you with a tracking number. You can also check the order information on the website or contact our sales staff for tracking.

Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

PSB21150FV1.4 provided by Rochester Electronics

As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.