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Rochester Electronics PN7462AUHN/C300E
IC RFID RDR/TRAN 13.56MZ 64HVQFN
Manufacturer # :PN7462AUHN/C300E
Manufacturer :Rochester Electronics
Dasenic # :PN7462AUHN/C300E-DS
Datasheet :
PN7462AUHN/C300E Datasheet
PN7462AUHN/C300E DatasheetCustomer # :
Description : IC RFID RDR/TRAN 13.56MZ 64HVQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 6.2460 | $ 6.25 |
| 25+ | $ 6.1200 | $ 153 |
| 100+ | $ 5.8680 | $ 586.8 |
| 500+ | $ 5.6250 | $ 2812.5 |
| 1000+ | $ 5.3100 | $ 5310 |
In Stock: 11232
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.246
Total :$ 6.25
Delivery :
Payment :
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PN7462AUHN/C300E information
Rochester Electronics PN7462AUHN/C300E technical specifications, attributes, parameters.
- Category:RF and Wireless/RFID, RF Access, Monitoring ICs
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:64-VFQFN Dual Rows, Exposed Pad
- Frequency:13.56MHz
- Type:RFID Reader/Transponder
- Interface:I²C, SPI, UART, USB
- Supplier Device Package:64-HVQFN (9x9)
- Standards:FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
- Voltage - Supply:1.65V ~ 3.6V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
PN7462AUHN/C300E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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