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1 : $16.2810
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Rochester Electronics PGA2310UA
IC VOLUME CONTROL 16SOIC
Manufacturer # :PGA2310UA
Manufacturer :Rochester Electronics
Dasenic # :PGA2310UA-DS
Datasheet :
PGA2310UA Datasheet
PGA2310UA DatasheetCustomer # :
Description : IC VOLUME CONTROL 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 16.2810 | $ 16.28 |
| 25+ | $ 15.9570 | $ 398.93 |
| 100+ | $ 15.3000 | $ 1530 |
| 500+ | $ 14.6520 | $ 7326 |
| 1000+ | $ 13.8420 | $ 13842 |
In Stock: 8214
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 16.281
Total :$ 16.28
Delivery :
Payment :
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PGA2310UA information
Rochester Electronics PGA2310UA technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Audio Special Purpose
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.295", 7.50mm Width)
- Number of Channels:2
- Interface:SPI
- Specifications:31.5dB ~ -95.5dB
- Supplier Device Package:16-SOIC
- Voltage - Supply:±4.5V ~ 15.5V
- Applications:Automotive Audio, Musical Instruments, Professional Audio
- Function:Volume Control
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
PGA2310UA provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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