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1 : $5.4000
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Rochester Electronics PEF22624EV1.3
SDFE-2 SYMMETRIC DSL FRONT END,
Manufacturer # :PEF22624EV1.3
Manufacturer :Rochester Electronics
Dasenic # :PEF22624EV1.3-DS
Datasheet :
PEF22624EV1.3 Datasheet
PEF22624EV1.3 DatasheetCustomer # :
Description : SDFE-2 SYMMETRIC DSL FRONT END,
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 5.4000 | $ 5.4 |
| 10+ | $ 5.1300 | $ 51.3 |
| 100+ | $ 4.8600 | $ 486 |
| 1000+ | $ 4.5900 | $ 4590 |
| 10000+ | $ 4.3200 | $ 43200 |
In Stock: 50062
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.4
Total :$ 5.40
Delivery :
Payment :
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PEF22624EV1.3 information
Rochester Electronics PEF22624EV1.3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:324-LBGA
- Current - Supply:-
- Interface:HDLC, Serial, TDM
- Supplier Device Package:P-LBGA-324
- Number of Circuits:2
- Power ( Watts):500 mW
- Voltage - Supply:-
- Function:Symmetrical DSL Front End (SDFE)
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:5A991B1
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
PEF22624EV1.3 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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