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Rochester Electronics PCA9555PW,112

IC I/O EXPANDER I2C 16B 24TSSOP
part number has RoHS
Manufacturer # :PCA9555PW,112
Manufacturer :Rochester Electronics
Dasenic # :PCA9555PW,112-DS
Customer # :
Description : IC I/O EXPANDER I2C 16B 24TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.7438$ 0.74
25+$ 0.7289$ 18.22
100+$ 0.6991$ 69.91
500+$ 0.6694$ 334.7
1000+$ 0.6322$ 632.2
In Stock: 18854
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7438
Total :$ 0.74
Delivery :
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Payment :
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PCA9555PW,112 information

  • Rochester Electronics PCA9555PW,112 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - I/O Expanders
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Features:POR
  • Mounting Type:Surface Mount
  • Package / Case:24-TSSOP (0.173", 4.40mm Width)
  • Output Type:Push-Pull
  • Interface:I²C, SMBus
  • Supplier Device Package:24-TSSOP
  • Voltage - Supply:2.3V ~ 5.5V
  • Number of I/ O:16
  • Interrupt Output:Yes
  • Current - Output Source/ Sink:10mA, 25mA
  • Clock Frequency:400 kHz
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
PCA9555PW,112 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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