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Rochester Electronics PCA9555DB,112

IC I/O EXPANDER I2C 16B 24SSOP
part number has RoHS
Manufacturer # :PCA9555DB,112
Manufacturer :Rochester Electronics
Dasenic # :PCA9555DB,112-DS
Customer # :
Description : IC I/O EXPANDER I2C 16B 24SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.9720$ 0.97
25+$ 0.9540$ 23.85
100+$ 0.9180$ 91.8
500+$ 0.8748$ 437.4
1000+$ 0.8262$ 826.2
In Stock: 1543
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.972
Total :$ 0.97
Delivery :
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Payment :
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PCA9555DB,112 information

  • Rochester Electronics PCA9555DB,112 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - I/O Expanders
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:POR
  • Mounting Type:Surface Mount
  • Package / Case:24-SSOP (0.209", 5.30mm Width)
  • Output Type:Push-Pull
  • Interface:I²C, SMBus
  • Supplier Device Package:24-SSOP
  • Voltage - Supply:2.3V ~ 5.5V
  • Number of I/ O:16
  • Interrupt Output:Yes
  • Current - Output Source/ Sink:10mA, 25mA
  • Clock Frequency:400 kHz
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
PCA9555DB,112 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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