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Rochester Electronics PCA8576CH/Q900,157

IC DRVR 7 SEGMENT 64LQFP
part number has RoHS
Manufacturer # :PCA8576CH/Q900,157
Manufacturer :Rochester Electronics
Dasenic # :PCA8576CH/Q900,157-DS
Customer # :
Description : IC DRVR 7 SEGMENT 64LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.7010$ 1.7
25+$ 1.6650$ 41.63
100+$ 1.6020$ 160.2
500+$ 1.5300$ 765
1000+$ 1.4490$ 1449
In Stock: 4692
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.701
Total :$ 1.70
Delivery :
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Payment :
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PCA8576CH/Q900,157 information

  • Rochester Electronics PCA8576CH/Q900,157 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Display Drivers
  • Product Status:Discontinued at Digi-Key
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:64-LQFP
  • Current - Supply:120 µA
  • Interface:I²C
  • Supplier Device Package:64-LQFP (10x10)
  • Configuration:7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
  • Voltage - Supply:2V ~ 6V
  • Display Type:LCD
  • Digits or Characters:10 Characters, 20 Characters, 160 Elements
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
PCA8576CH/Q900,157 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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