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1 : $18.2340
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Rochester Electronics PALCE20V8H-25E4/B3A
ELECTRICALLY ERASABLE PAL DEVICE
Manufacturer # :PALCE20V8H-25E4/B3A
Manufacturer :Rochester Electronics
Dasenic # :PALCE20V8H-25E4/B3A-DS
Datasheet :
PALCE20V8H-25E4/B3A Datasheet
PALCE20V8H-25E4/B3A DatasheetCustomer # :
Description : ELECTRICALLY ERASABLE PAL DEVICE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 18.2340 | $ 18.23 |
| 25+ | $ 17.8650 | $ 446.63 |
| 100+ | $ 17.1360 | $ 1713.6 |
| 500+ | $ 16.4070 | $ 8203.5 |
| 1000+ | $ 15.4980 | $ 15498 |
In Stock: 1727
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 18.234
Total :$ 18.23
Delivery :
Payment :
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PALCE20V8H-25E4/B3A information
Rochester Electronics PALCE20V8H-25E4/B3A technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - PLDs (Programmable Logic Device)
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:28-CLCC
- Voltage - Input:4.5V ~ 5.5V
- Supplier Device Package:28-CLCC (11.43x11.43)
- Programmable Type:PAL
- Number of Macrocells:8
- Speed:25 ns
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:3A001A2C
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
PALCE20V8H-25E4/B3A provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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