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Rochester Electronics OMAPL138BZWTA3
Manufacturer # :OMAPL138BZWTA3
Manufacturer :Rochester Electronics
Dasenic # :OMAPL138BZWTA3-DS
Datasheet : OMAPL138BZWTA3 Datasheet
Customer # :
Description : IC MPU OMAP-L1X 375MHZ 361NFBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1529
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 239.5014
Total :$ 239.50
Delivery :
Payment :
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OMAPL138BZWTA3 information
Rochester Electronics OMAPL138BZWTA3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microprocessors
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 105°C (TJ)
- Package / Case:361-LFBGA
- Supplier Device Package:361-NFBGA (16x16)
- Voltage - I/ O:1.8V, 3.3V
- Speed:375MHz
- Core Processor:ARM926EJ-S
- Number of Cores/ Bus Width:1 Core, 32-Bit
- Co- Processors/ D S P:Signal Processing; C674x, System Control; CP15
- R A M Controllers:SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:LCD
- Ethernet:10/100Mbps (1)
- S A T A:SATA 3Gbps (1)
- U S B:USB 1.1 + PHY (1), USB 2.0 + PHY (1)
- Security Features:Boot Security, Cryptography
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
OMAPL138BZWTA3 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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