Name: OMAP3530DZCBB
Brand: Rochester Electronics
SKU: DS-5671579
Price: 74.457 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $74.4570

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Rochester Electronics OMAP3530DZCBB

IC MPU OMAP-35XX 600MHZ 515FCBGA

Manufacturer # :OMAP3530DZCBB

Manufacturer :Rochester Electronics

Dasenic # :OMAP3530DZCBB-DS

Datasheet :

OMAP3530DZCBB Datasheet

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Customer #

Description : IC MPU OMAP-35XX 600MHZ 515FCBGA

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Quantity	Unit Price	Total
1+	$ 74.4570	$ 74.46
25+	$ 72.9720	$ 1824.3
100+	$ 69.9930	$ 6999.3
500+	$ 67.0140	$ 33507
1000+	$ 63.2880	$ 63288

In Stock: 1668

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 74.457

Total :$ 74.46

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OMAP3530DZCBB information

Rochester Electronics OMAP3530DZCBB technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Embedded - Microprocessors
Product Status:Obsolete
Operating Temperature:0°C ~ 90°C (TJ)
Package / Case:515-VFBGA, FCBGA
Supplier Device Package:515-POP-FCBGA (12x12)
Voltage - I/ O:1.8V, 3.0V
Speed:600MHz
Core Processor:ARM® Cortex®-A8
Number of Cores/ Bus Width:1 Core, 32-Bit
Co- Processors/ D S P:Signal Processing; C64x+, Multimedia; NEON™ SIMD
R A M Controllers:LPDDR
Graphics Acceleration:Yes
Display & Interface Controllers:LCD
Ethernet:-
S A T A:-
U S B:USB 1.x (3), USB 2.0 (1)
Security Features:-
EU RoHS Status:ROHS3 Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:5A002A1 TI
HTS US:8542.31.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Rochester Electronics OMAP3530DZCBB
Datasheet:
OMAP3530DZCBB,

Rochester Electronics OMAP3530DZCBB Environmental and export classification status description
The Texas Instruments OMAP3530DZCBB is a system-on-chip (SoC) solution that falls under the Integrated Circuits (ICs) category. It is designed to provide high-performance computing capabilities for a wide range of applications. Functions: - Contains an ARM Cortex-A8 processor core running at speeds up to 600 MHz - Integrates a TMS320C64x+ digital signal processor (DSP) core - Supports various multimedia codecs, graphics acceleration, and image processing - Includes interface options for connectivity such as USB, Ethernet, and display outputs Applications: - Mobile phones and smartphones - Portable media players - Personal navigation devices - Industrial control systems - Automotive infotainment systems Alternative components: - NXP i.MX6 series - Qualcomm Snapdragon processors - Samsung Exynos processors - MediaTek Helio series - Rockchip RK series Embedded modules: - Power management unit - Memory controllers - Security features for data protection - Connectivity modules (Wi-Fi, Bluetooth, GPS) Related Q&A: 1. How does the OMAP3530DZCBB differ from other SoCs in terms of power efficiency? 2. What are the key advantages of using the OMAP3530DZCBB in automotive infotainment systems? 3. Can the OMAP3530DZCBB handle real-time multimedia processing tasks efficiently? 4. Are there any known issues or limitations associated with the OMAP3530DZCBB that developers should be aware of? 5. What are the potential future upgrades or successors to the OMAP3530DZCBB in terms of performance and features?

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

OMAP3530DZCBB provided by Rochester Electronics

As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.