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Rochester Electronics NSBC114EDXV6

TRANS 2NPN PREBIAS 0.5W SOT563
part number has RoHS
Manufacturer # :NSBC114EDXV6
Manufacturer :Rochester Electronics
Dasenic # :NSBC114EDXV6-DS
Customer # :
Description : TRANS 2NPN PREBIAS 0.5W SOT563
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0410$ 0.04
25+$ 0.0401$ 1
100+$ 0.0385$ 3.85
500+$ 0.0369$ 18.45
1000+$ 0.0348$ 34.8
In Stock: 14400
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.041
Total :$ 0.04
Delivery :
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Payment :
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NSBC114EDXV6 information

  • Rochester Electronics NSBC114EDXV6 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Power - Max:-
  • Supplier Device Package:-
  • Transistor Type:-
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):-
  • Vce Saturation ( Max) @ Ib, Ic:-
  • Current - Collector Cutoff ( Max):-
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:-
  • Frequency - Transition:-
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8541.21.0095
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
NSBC114EDXV6 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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