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Rochester Electronics NM93C46TLZEM8

EEPROM, 64X16, SERIAL, CMOS
part number has RoHS
Manufacturer # :NM93C46TLZEM8
Manufacturer :Rochester Electronics
Dasenic # :NM93C46TLZEM8-DS
Customer # :
Description : EEPROM, 64X16, SERIAL, CMOS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.2250$ 0.23
100+$ 0.2093$ 20.93
1000+$ 0.2025$ 202.5
10000+$ 0.1913$ 1913
In Stock: 50661
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.225
Total :$ 0.23
Delivery :
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Payment :
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NM93C46TLZEM8 information

  • Rochester Electronics NM93C46TLZEM8 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Technology:EEPROM
  • Supplier Device Package:8-SOIC
  • Memory Size:1Kb (64 x 16)
  • Memory Type:Non-Volatile
  • Voltage - Supply:2.7V ~ 5.5V
  • Clock Frequency:250 kHz
  • Access Time:-
  • Memory Format:EEPROM
  • Memory Interface:SPI
  • Write Cycle Time - Word, Page:15ms
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8542.32.0051
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
NM93C46TLZEM8 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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