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Rochester Electronics NLV74HC573ADWR2
IC LATCH OCT 3ST NONINV 20SOIC
Manufacturer # :NLV74HC573ADWR2
Manufacturer :Rochester Electronics
Dasenic # :NLV74HC573ADWR2-DS
Datasheet :
NLV74HC573ADWR2 Datasheet
NLV74HC573ADWR2 DatasheetCustomer # :
Description : IC LATCH OCT 3ST NONINV 20SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.2828 | $ 0.28 |
| 25+ | $ 0.2771 | $ 6.93 |
| 100+ | $ 0.2658 | $ 26.58 |
| 500+ | $ 0.2545 | $ 127.25 |
| 1000+ | $ 0.2404 | $ 240.4 |
In Stock: 8400
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2828
Total :$ 0.28
Delivery :
Payment :
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NLV74HC573ADWR2 information
Rochester Electronics NLV74HC573ADWR2 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Latches
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:20-SOIC (0.295", 7.50mm Width)
- Output Type:Tri-State
- Supplier Device Package:20-SOIC
- Voltage - Supply:2V ~ 6V
- Logic Type:D-Type Transparent Latch
- Current - Output High, Low:7.8mA, 7.8mA
- Circuit:1:8
- Independent Circuits:1
- Delay Time - Propagation:26ns
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
NLV74HC573ADWR2 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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