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Rochester Electronics NB6L11DTG

IC CLK BUFFER 1:2 6GHZ 8TSSOP
part number has RoHS
Manufacturer # :NB6L11DTG
Manufacturer :Rochester Electronics
Dasenic # :NB6L11DTG-DS
Customer # :
Description : IC CLK BUFFER 1:2 6GHZ 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 20.7720$ 20.77
100+$ 15.5790$ 1557.9
1000+$ 13.5000$ 13500
In Stock: 1642
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 20.772
Total :$ 20.77
Delivery :
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Payment :
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NB6L11DTG information

  • Rochester Electronics NB6L11DTG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Type:Fanout Buffer (Distribution), Translator
  • Supplier Device Package:8-TSSOP
  • Frequency - Max:6 GHz
  • Number of Circuits:1
  • Output:ECL
  • Voltage - Supply:2.375V ~ 3.465V
  • Input:CML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTL
  • Ratio - Input: Output:1:2
  • Differential - Input: Output:Yes/Yes
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
NB6L11DTG provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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