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Rochester Electronics NB3M8302CDG

IC CLK BUFFER 1:2 200MHZ LVCMOS
part number has RoHS
Manufacturer # :NB3M8302CDG
Manufacturer :Rochester Electronics
Dasenic # :NB3M8302CDG-DS
Customer # :
Description : IC CLK BUFFER 1:2 200MHZ LVCMOS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.1500$ 3.15
10+$ 2.3040$ 23.04
25+$ 2.0700$ 51.75
98+$ 1.4220$ 139.36
294+$ 1.3680$ 402.19
In Stock: 7460
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.15
Total :$ 3.15
Delivery :
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Payment :
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NB3M8302CDG information

  • Rochester Electronics NB3M8302CDG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Type:Fanout Buffer (Distribution)
  • Supplier Device Package:8-SOIC
  • Frequency - Max:200 MHz
  • Number of Circuits:1
  • Output:LVCMOS, LVTTL
  • Voltage - Supply:3.135V ~ 3.465V
  • Input:LVCMOS, LVTTL
  • Ratio - Input: Output:1:2
  • Differential - Input: Output:No/No
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
NB3M8302CDG provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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