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Rochester Electronics NB100LVEP222FA

IC CLK BUFF DVDR MUX 1:15 52LQFP
part number has RoHS
Manufacturer # :NB100LVEP222FA
Manufacturer :Rochester Electronics
Dasenic # :NB100LVEP222FA-DS
Customer # :
Description : IC CLK BUFF DVDR MUX 1:15 52LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0090$ 0.01
10+$ 0.0090$ 0.09
100+$ 0.0090$ 0.9
500+$ 0.0090$ 4.5
1000+$ 0.0090$ 9
In Stock: 22937
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.009
Total :$ 0.01
Delivery :
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Payment :
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NB100LVEP222FA information

  • Rochester Electronics NB100LVEP222FA technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Obsolete
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:52-LQFP Exposed Pad
  • Type:Fanout Buffer (Distribution), Divider, Multiplexer
  • Supplier Device Package:52-LQFP (10x10)
  • Frequency - Max:-
  • Number of Circuits:-
  • Output:-
  • Voltage - Supply:-
  • Input:-
  • Ratio - Input: Output:1:15
  • Differential - Input: Output:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:2 (1 Year,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
NB100LVEP222FA provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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