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Rochester Electronics N01L63W3AT25I

IC SRAM 1MBIT PARALLEL 44TSOP II
part number has RoHS
Manufacturer # :N01L63W3AT25I
Manufacturer :Rochester Electronics
Dasenic # :N01L63W3AT25I-DS
Customer # :
Description : IC SRAM 1MBIT PARALLEL 44TSOP II
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.5390$ 1.54
25+$ 1.5120$ 37.8
100+$ 1.4490$ 144.9
500+$ 1.3860$ 693
1000+$ 1.3050$ 1305
In Stock: 38344
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.539
Total :$ 1.54
Delivery :
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Payment :
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N01L63W3AT25I information

  • Rochester Electronics N01L63W3AT25I technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:44-TSOP (0.400", 10.16mm Width)
  • Technology:SRAM - Asynchronous
  • Supplier Device Package:44-TSOP II
  • Memory Size:1Mb (64K x 16)
  • Memory Type:Volatile
  • Voltage - Supply:2.3V ~ 3.6V
  • Clock Frequency:-
  • Access Time:55 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:55ns
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.32.0041
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
N01L63W3AT25I provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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