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Rochester Electronics MSP430U275IPM

IC MCU ASIC DOLPHIN CHIP 64LQFP
part number has RoHS
Manufacturer # :MSP430U275IPM
Manufacturer :Rochester Electronics
Dasenic # :MSP430U275IPM-DS
Customer # :
Description : IC MCU ASIC DOLPHIN CHIP 64LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 5.4990$ 5.5
25+$ 5.3910$ 134.78
100+$ 5.1660$ 516.6
500+$ 4.9500$ 2475
1000+$ 4.6710$ 4671
In Stock: 9120
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.499
Total :$ 5.50
Delivery :
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Payment :
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MSP430U275IPM information

  • Rochester Electronics MSP430U275IPM technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
  • Product Status:Discontinued at Digi-Key
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:64-LQFP
  • Supplier Device Package:64-LQFP (10x10)
  • Peripherals:-
  • Number of I/ O:-
  • Speed:-
  • E E P R O M Size:-
  • Core Processor:-
  • R A M Size:-
  • Program Memory Type:-
  • Core Size:-
  • Connectivity:-
  • Program Memory Size:-
  • Voltage - Supply ( Vcc/ Vdd):-
  • Data Converters:-
  • Oscillator Type:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MSP430U275IPM provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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