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Rochester Electronics MSP430F5259IZQE
Manufacturer # :MSP430F5259IZQE
Manufacturer :Rochester Electronics
Dasenic # :MSP430F5259IZQE-DS
Datasheet : MSP430F5259IZQE Datasheet
Customer # :
Description : IC MCU 16BIT 128KB FLASH 80BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 4320
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.736
Total :$ 2.74
Delivery :
Payment :
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MSP430F5259IZQE information
Rochester Electronics MSP430F5259IZQE technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:80-VFBGA
- Supplier Device Package:80-BGA MICROSTAR JUNIOR (5x5)
- Peripherals:Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/ O:53
- Speed:25MHz
- E E P R O M Size:-
- Core Processor:MSP430 CPUXV2
- R A M Size:32K x 8
- Program Memory Type:Flash
- Core Size:16-Bit
- Connectivity:I²C, IrDA, SCI, SPI, UART/USART
- Program Memory Size:128KB (128K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.8V ~ 3.6V
- Data Converters:A/D 12x10b
- Oscillator Type:Internal
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MSP430F5259IZQE provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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