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Rochester Electronics MSP430F2619TZQW
Manufacturer # :MSP430F2619TZQW
Manufacturer :Rochester Electronics
Dasenic # :MSP430F2619TZQW-DS
Datasheet : MSP430F2619TZQW Datasheet
Customer # :
Description : IC MCU 16BIT 120KB FLASH 113BGA
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In Stock: 53640
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.732
Total :$ 6.73
Delivery :
Payment :
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MSP430F2619TZQW information
Rochester Electronics MSP430F2619TZQW technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Package / Case:113-VFBGA
- Supplier Device Package:113-BGA Microstar Junior (7x7)
- Peripherals:Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/ O:64
- Speed:16MHz
- E E P R O M Size:-
- Core Processor:MSP430 CPU16
- R A M Size:4K x 8
- Program Memory Type:Flash
- Core Size:16-Bit
- Connectivity:I²C, IrDA, LINbus, SCI, SPI, UART/USART
- Program Memory Size:120KB (120K x 8 + 256B)
- Voltage - Supply ( Vcc/ Vdd):1.8V ~ 3.6V
- Data Converters:A/D 8x12b; D/A 2x12b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MSP430F2619TZQW provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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