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Rochester Electronics MSC8144ETVT800A

DSP, 133MHZ PBGA783
part number has RoHS
Manufacturer # :MSC8144ETVT800A
Manufacturer :Rochester Electronics
Dasenic # :MSC8144ETVT800A-DS
Customer # :
Description : DSP, 133MHZ PBGA783
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 496.6000$ 496.6
25+$ 486.6800$ 12167
100+$ 466.8000$ 46680
500+$ 446.9400$ 223470
1000+$ 422.1200$ 422120
In Stock: 1510
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 496.6
Total :$ 496.60
Delivery :
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Payment :
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MSC8144ETVT800A information

  • Rochester Electronics MSC8144ETVT800A technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 105°C
  • Mounting Type:Surface Mount
  • Package / Case:783-BBGA, FCBGA
  • Type:SC3400 Core
  • Interface:Ethernet, I²C, SPI, TDM, UART, UTOPIA
  • Supplier Device Package:783-FCBGA (29x29)
  • Clock Rate:800MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:10.5MB
  • Voltage - I/ O:3.30V
  • Voltage - Core:1.00V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:5A002A1
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MSC8144ETVT800A provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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