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Rochester Electronics MPC8572ECVTAULE557
Manufacturer # :MPC8572ECVTAULE557
Manufacturer :Rochester Electronics
Dasenic # :MPC8572ECVTAULE557-DS
Datasheet : MPC8572ECVTAULE557 Datasheet
Customer # :
Description : POWERQUICC RISC MICROPROCESSOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1612
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 287.593
Total :$ 287.59
Delivery :
Payment :
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MPC8572ECVTAULE557 information
Rochester Electronics MPC8572ECVTAULE557 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TA)
- Package / Case:1023-BBGA, FCBGA
- Supplier Device Package:1023-FCBGA (33x33)
- Voltage - I/ O:1.5V, 1.8V, 2.5V, 3.3V
- Speed:1.333GHz
- Core Processor:PowerPC e500
- Number of Cores/ Bus Width:2 Core, 32-Bit
- Co- Processors/ D S P:Signal Processing; SPE, Security; SEC
- R A M Controllers:DDR2, DDR3
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (4)
- S A T A:-
- U S B:-
- Security Features:Cryptography, Random Number Generator
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:5A002A1 FRE
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MPC8572ECVTAULE557 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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