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Rochester Electronics MKW21D512VHA5
IC RF TXRX+MCU 802.15.4 63VFLGA
Manufacturer # :MKW21D512VHA5
Manufacturer :Rochester Electronics
Dasenic # :MKW21D512VHA5-DS
Datasheet :
MKW21D512VHA5 Datasheet
MKW21D512VHA5 DatasheetCustomer # :
Description : IC RF TXRX+MCU 802.15.4 63VFLGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 2+ | $ 5.4342 | $ 10.87 |
In Stock: 5400
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.4342
Total :$ 5.43
Delivery :
Payment :
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MKW21D512VHA5 information
Rochester Electronics MKW21D512VHA5 technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C
- Mounting Type:Surface Mount
- Package / Case:63-VFLGA
- Frequency:2.4GHz
- Type:TxRx + MCU
- Sensitivity:-102dBm
- Supplier Device Package:63-MAPLGA (8x8)
- Data Rate ( Max):250kbps
- Memory Size:512kB Flash, 64kB SRAM
- Voltage - Supply:1.8V ~ 3.6V
- Power - Output:8dBm
- Protocol:Zigbee®
- Serial Interfaces:I²C, JTAG, SPI, UART
- R F Family/ Standard:802.15.4
- Current - Receiving:15mA
- Modulation:DSSS, O-QPSK
- G P I O:2
- Current - Transmitting:19mA
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MKW21D512VHA5 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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