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Rochester Electronics MIC5330-SKYML
Manufacturer # :MIC5330-SKYML
Manufacturer :Rochester Electronics
Dasenic # :MIC5330-SKYML-DS
Datasheet : MIC5330-SKYML Datasheet
Customer # :
Description : IC REG LIN 2.6V/3.3V 300MA 8MLF
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 20243
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4607
Total :$ 0.46
Delivery :
Payment :
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MIC5330-SKYML information
Rochester Electronics MIC5330-SKYML technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - Linear
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:8-VFDFN Exposed Pad, 8-MLF®
- Output Type:Fixed
- Voltage - Input ( Max):5.5V
- Supplier Device Package:8-MLF® (2x2)
- Current - Supply ( Max):200 µA
- Current - Output:300mA, 300mA
- Current - Quiescent ( Iq):120 µA
- Control Features:Enable
- Output Configuration:Positive
- Voltage - Output ( Min/ Fixed):2.6V, 3.3V
- Voltage - Output ( Max):-
- Number of Regulators:2
- Voltage Dropout ( Max):0.2V @ 300mA, 0.2V @ 300mA
- P S R R:70dB ~ 65dB (1kHz ~ 20kHz)
- Protection Features:Over Current, Over Temperature
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MIC5330-SKYML provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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