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Rochester Electronics MIC38C43BMM TR
Manufacturer # :MIC38C43BMM TR
Manufacturer :Rochester Electronics
Dasenic # :MIC38C43BMM TR-DS
Datasheet : MIC38C43BMM TR Datasheet
Customer # :
Description : BICMOS CURRENT-MODE PWM CONTROLL
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 10353
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.315
Total :$ 0.32
Delivery :
Payment :
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MIC38C43BMM TR information
Rochester Electronics MIC38C43BMM TR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - DC DC Switching Controllers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Output Type:Transistor Driver
- Supplier Device Package:8-MSOP
- Voltage - Supply ( Vcc/ Vdd):7.6V ~ 20V
- Frequency - Switching:500kHz
- Number of Outputs:1
- Topology:Boost, Buck, Flyback, Forward Converter
- Control Features:Frequency Control
- Output Configuration:Positive, Isolation Capable
- Output Phases:1
- Duty Cycle ( Max):96%
- Synchronous Rectifier:Yes
- Clock Sync:No
- Serial Interfaces:-
- Function:Step-Up, Step-Down, Step-Up/Step-Down
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MIC38C43BMM TR provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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