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Rochester Electronics MIC2940A-33BU
Manufacturer # :MIC2940A-33BU
Manufacturer :Rochester Electronics
Dasenic # :MIC2940A-33BU-DS
Datasheet : MIC2940A-33BU Datasheet
Customer # :
Description : IC REG LINEAR 3.3V 1.25A TO263-3
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In Stock: 10689
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6655
Total :$ 0.67
Delivery :
Payment :
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MIC2940A-33BU information
Rochester Electronics MIC2940A-33BU technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - Linear
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-263-4, D²Pak (3 Leads + Tab), TO-263AA
- Output Type:Fixed
- Voltage - Input ( Max):26V
- Supplier Device Package:TO-263-3
- Current - Supply ( Max):70 mA
- Current - Output:1.25A
- Current - Quiescent ( Iq):500 µA
- Control Features:Enable
- Output Configuration:Positive
- Voltage - Output ( Min/ Fixed):3.3V
- Voltage - Output ( Max):-
- Number of Regulators:1
- Voltage Dropout ( Max):0.6V @ 1.25A
- P S R R:-
- Protection Features:Over Current, Over Temperature, Reverse Polarity, Load Dump, Transient Voltage
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MIC2940A-33BU provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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