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Rochester Electronics MCIMX6Y7DVM09AA
Manufacturer # :MCIMX6Y7DVM09AA
Manufacturer :Rochester Electronics
Dasenic # :MCIMX6Y7DVM09AA-DS
Datasheet : MCIMX6Y7DVM09AA Datasheet
Customer # :
Description : I.MX 6ULL 900 MHZ CONSUMER WITH
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1511
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 72.2423
Total :$ 72.24
Delivery :
Payment :
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MCIMX6Y7DVM09AA information
Rochester Electronics MCIMX6Y7DVM09AA technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:0°C ~ 95°C (TJ)
- Package / Case:289-LFBGA
- Supplier Device Package:289-MAPBGA (14x14)
- Voltage - I/ O:1.8V, 2.8V, 3.3V
- Speed:900MHz
- Core Processor:ARM® Cortex®-A7
- Number of Cores/ Bus Width:1 Core, 32-Bit
- Co- Processors/ D S P:Multimedia; NEON™ MPE
- R A M Controllers:LPDDR2, DDR3, DDR3L
- Graphics Acceleration:No
- Display & Interface Controllers:Electrophoretic, LCD
- Ethernet:10/100Mbps (2)
- S A T A:-
- U S B:USB 2.0 OTG + PHY (2)
- Security Features:A-HAB, ARM TZ, CSU, SJC, SNVS
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A992C
- HTS US:8542.31.0001
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MCIMX6Y7DVM09AA provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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