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1 : $23.6070
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Rochester Electronics MCF5102PV33B
MCF5102PV33B
Manufacturer # :MCF5102PV33B
Manufacturer :Rochester Electronics
Dasenic # :MCF5102PV33B-DS
Datasheet :
MCF5102PV33B Datasheet
MCF5102PV33B DatasheetCustomer # :
Description : MCF5102PV33B
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 23.6070 | $ 23.61 |
| 25+ | $ 23.1390 | $ 578.48 |
| 100+ | $ 22.1940 | $ 2219.4 |
| 500+ | $ 21.2490 | $ 10624.5 |
| 1000+ | $ 20.0700 | $ 20070 |
In Stock: 56270
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 23.607
Total :$ 23.61
Delivery :
Payment :
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MCF5102PV33B information
Rochester Electronics MCF5102PV33B technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Operating Temperature:-
- Package / Case:-
- Supplier Device Package:-
- Voltage - I/ O:-
- Speed:-
- Core Processor:-
- Number of Cores/ Bus Width:-
- Co- Processors/ D S P:-
- R A M Controllers:-
- Graphics Acceleration:-
- Display & Interface Controllers:-
- Ethernet:-
- S A T A:-
- U S B:-
- Security Features:-
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- HTS US:0000.00.0000
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MCF5102PV33B provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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