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Rochester Electronics MC74HC08ADT

IC GATE AND 4CH 2-INP 14TSSOP
part number has RoHS
Manufacturer # :MC74HC08ADT
Manufacturer :Rochester Electronics
Dasenic # :MC74HC08ADT-DS
Customer # :
Description : IC GATE AND 4CH 2-INP 14TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0878$ 0.09
25+$ 0.0860$ 2.15
100+$ 0.0825$ 8.25
500+$ 0.0789$ 39.45
1000+$ 0.0746$ 74.6
In Stock: 23151
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0878
Total :$ 0.09
Delivery :
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MC74HC08ADT information

  • Rochester Electronics MC74HC08ADT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Gates and Inverters
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:14-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package:14-TSSOP
  • Number of Circuits:4
  • Voltage - Supply:2V ~ 6V
  • Number of Inputs:2
  • Current - Quiescent ( Max):1 µA
  • Logic Type:AND Gate
  • Current - Output High, Low:5.2mA, 5.2mA
  • Max Propagation Delay @ V, Max C L:13ns @ 6V, 50pF
  • Logic Level - Low:0.5V ~ 1.8V
  • Logic Level - High:1.5V ~ 4.2V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC74HC08ADT provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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