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1 : $0.2340
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Rochester Electronics MC74F257AN
IC MULTIPLEXER 4 X 2:1 16DIP
Manufacturer # :MC74F257AN
Manufacturer :Rochester Electronics
Dasenic # :MC74F257AN-DS
Datasheet :
MC74F257AN Datasheet
MC74F257AN DatasheetCustomer # :
Description : IC MULTIPLEXER 4 X 2:1 16DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.2340 | $ 0.23 |
| 25+ | $ 0.2293 | $ 5.73 |
| 100+ | $ 0.2200 | $ 22 |
| 500+ | $ 0.2106 | $ 105.3 |
| 1000+ | $ 0.1989 | $ 198.9 |
In Stock: 40889
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.234
Total :$ 0.23
Delivery :
Payment :
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MC74F257AN information
Rochester Electronics MC74F257AN technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Through Hole
- Package / Case:16-DIP (0.300", 7.62mm)
- Type:Multiplexer
- Supplier Device Package:16-PDIP
- Voltage - Supply:4.5V ~ 5.5V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:24mA, 3mA
- Circuit:4 x 2:1
- Independent Circuits:1
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MC74F257AN provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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