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Rochester Electronics MC74ACT273DT

D FLIP-FLOP, ACT SERIES
part number has RoHS
Manufacturer # :MC74ACT273DT
Manufacturer :Rochester Electronics
Dasenic # :MC74ACT273DT-DS
Customer # :
Description : D FLIP-FLOP, ACT SERIES
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.1658$ 0.17
25+$ 0.1625$ 4.06
100+$ 0.1558$ 15.58
500+$ 0.1492$ 74.6
1000+$ 0.1409$ 140.9
In Stock: 7620
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1658
Total :$ 0.17
Delivery :
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Payment :
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MC74ACT273DT information

  • Rochester Electronics MC74ACT273DT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Flip Flops
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Type:-
  • Output Type:-
  • Supplier Device Package:-
  • Number of Elements:-
  • Voltage - Supply:-
  • Clock Frequency:-
  • Number of Bits per Element:-
  • Current - Output High, Low:-
  • Max Propagation Delay @ V, Max C L:-
  • Current - Quiescent ( Iq):-
  • Trigger Type:-
  • Input Capacitance:-
  • Function:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC74ACT273DT provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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