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Rochester Electronics MC14069UBD

IC INVERTER HEX 6CH 1-INP 14SOIC
part number has RoHS
Manufacturer # :MC14069UBD
Manufacturer :Rochester Electronics
Dasenic # :MC14069UBD-DS
Customer # :
Description : IC INVERTER HEX 6CH 1-INP 14SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.1658$ 0.17
25+$ 0.1625$ 4.06
100+$ 0.1558$ 15.58
500+$ 0.1492$ 74.6
1000+$ 0.1409$ 140.9
In Stock: 10788
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1658
Total :$ 0.17
Delivery :
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Payment :
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MC14069UBD information

  • Rochester Electronics MC14069UBD technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Gates and Inverters
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:14-SOIC
  • Number of Circuits:6
  • Voltage - Supply:3V ~ 18V
  • Number of Inputs:1
  • Current - Quiescent ( Max):1 µA
  • Logic Type:Inverter
  • Current - Output High, Low:8.8mA, 8.8mA
  • Max Propagation Delay @ V, Max C L:55ns @ 15V, 50pF
  • Logic Level - Low:1V ~ 2.5V
  • Logic Level - High:4V ~ 12.5V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC14069UBD provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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